Our Products
A comprehensive range of precision 3D metrology systems designed to meet diverse industry requirements in electronics manufacturing and quality control.

A600
Fully Automatic 3D Metrology System
The A600™ is the latest fully automatic, set-and-forget solder paste inspection system designed for monitoring solder paste printing processes. Featuring white light and infrared structured light scanning with real-time autofocus laser stripe, it delivers unmatched accuracy with aircraft-grade aluminum construction.
Key Features
Specifications
XY Resolution
10μm
Z Resolution
1μm
Field of View
26mm × 19.5mm
Inspection Speed
17 cm²/sec
FOV Measurement
0.3 sec
Motion Travel
450×400×50mm
Measurement Range
25μm to 400μm
GR&R Accuracy
<2% calibration std

M500
Manual 3D Metrology System
An advanced benchtop 3D metrology system using structured light scanning technology. Zero-maintenance design with aircraft-grade aluminum sensor and granite base. Single-click operation with automatic solder paste recognition. Available in standard and HR (high-resolution) variants.
Key Features
Specifications
XY Resolution
4μm (2.5μm HR)
Z Resolution
0.5μm (0.125μm HR)
Field of View
8×6mm (7×5.2mm HR)
Z Range
10–400μm (5–350μm HR)
Image Sensor
3MP color / 5MP mono HR
Processing Time
<0.2 sec (<0.5 sec HR)
Power
<15W nominal
GR&R Accuracy
<2% calibration std

VM450
3D Metrology System
State-of-the-art desktop solder paste inspection system combining the accuracy of the VM150 with upgraded 3MP color CMOS imaging and power-efficient LED technology. Features fully automatic height and true volume measurement with complete 3D color profiles.
Key Features
Specifications
XY Resolution
4.0 μm
Z Resolution
2 μm
Field of View
8 × 4mm
Z Range
0.3mm
Processing Time
0.7 sec
Power
<20W nominal
Dimensions
450 × 610 × 300mm
Weight
20 kg

VM400
3D Metrology System
Desktop solder paste inspection system offering true plug-and-play operation with the same accuracy and repeatability as the VM150. Features built-in high power halogen lamp, fully automatic height and true volume measurement with complete 3D color profiles.
Key Features
Specifications
XY Resolution
4.0 μm
Z Resolution
2 μm
Field of View
6 × 4.5mm
Z Range
0.3mm
Processing Time
~2 sec
Power
200W
Dimensions
450 × 610 × 500mm
Weight
30 kg

VM150
3D Solder Paste Inspection System
The original VisionMaster system for precise 3D measurements of solder paste pads, ball grid arrays, and general small objects. Fully automatic height and true volume measurement with excellent repeatability and complete 3D color profile display.
Key Features
Specifications
XY Resolution
1.5 μm
Z Resolution
1 μm
Field of View
2.8 × 2.1mm
Z Range
0.3mm
Processing Time
~5 sec
Power
200W
Dimensions
560 × 610 × 230mm
Weight
20 kg
Need Help Choosing?
Our team of experts will help you select the perfect metrology system for your specific requirements and production environment.